Precision Dipping Solutions for High-Frequency Passive Components

Precision Dipping Solutions for High-Frequency Passive Components

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In today’s fast-paced communications and networking sector, the demand for reliable signal integrity and ongoing miniaturization is more critical than ever. Passive components such as MLCCs, chip resistors, and inductors play a foundational role in ensuring the performance of high-frequency applications, including 5G base stations, Wi-Fi routers, fiber optics, and RF front-end modules.

LONG’s suite of TCP, Array, and Termination Automatic Dipping Machines is engineered to address these evolving requirements with a focus on precision, consistency, and reliability. These systems are purpose-built for the production of passive components, delivering uniform paste thickness, reduced contamination, and optimized electrical characteristics.

TCP Automatic Single Side Dipping Machine TCP Automatic Loading and Unloading Dipping Machine with vacuum debubble function TCP Automatic Loading and Unloading Dipping Machine

Thin Carrier Plate (TCP) Technology: Supporting Miniaturization

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LONG’s patented Thin Carrier Plate (TCP) technology is designed to provide exceptional dimensional stability for passive component handling. The flatness and precise positioning capabilities of the TCP enable accurate alignment and repeatable dipping, which are essential for applications with tight tolerances, such as:

• RF filters
• High-frequency chip inductors
• Low-noise amplifiers (LNA)

By minimizing misalignment and process variability, this technology helps maintain consistent impedance and reduce return loss—key factors for optimal RF circuit performance.

(TCP) Thin Carrier Plate

Automation and Production Efficiency

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LONG’s automated dipping solutions are designed to support high-volume manufacturing environments. Key features include:

• High-speed handling for increased throughput
• Advanced alignment and precision control
• Consistent dipping parameters for uniform film thickness
• Automated debris removal systems to minimize contamination

These capabilities enable telecom component manufacturers to scale production efficiently while maintaining stringent quality standards.

Application Areas

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LONG’s termination, array, and slant dipping machines are integral to the manufacturing of a wide range of telecom and networking hardware, including:

• 5G mmWave modules
• Optical transceivers
• Wireless access points
• Network switches and servers

By integrating LONG’s dipping technology, manufacturers can achieve improved yield rates, reduced signal path variability, and compliance with global quality benchmarks.

For further technical specifications or detailed functional information, please contact us.